Advanced Diamond Technologies, Inc.
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Advanced Diamond Technologies, Inc.
Advanced Diamond Technologies, Inc.
Advanced Diamond Technologies, Inc.
Advanced Diamond Technologies, Inc.

July 14, 2010
ADT Awarded Grant to develop the next generation of CMP pad conditioners.

June 30, 2010
VISIT ADT at SEMICON WEST, July 13-15, in the Extreme Electronics section, booth #2536.

June 21, 2010
ADT co-founder and Argonne scientist, Orlando Auciello, announced as Distinguished Fellow by the U.S. Department of Energy.

June 16, 2010
ADT publishes groundbreaking work in the May 2010 issue of the journal ACS Nano. Read the full press release here.

June 11, 2010
Neil Kane of Advanced Diamond Technologies testifies before House Subcommittee on improving technology transfer.

May 26, 2010
The prestigious journal Small publishes paper on extreme wear properties of NaDiaProbes.

May 19, 2010
ADT scientists co-author an article on the wear resistance of diamond nanoprobe tips in ACS Nano.

May 18, 2010
John Carlisle, CTO, to present "Diamond MEMS: from the lab to the foundry" at the MEMS CTO Meeting on June 21st in Anaheim, California.

May 11, 2010
Dr. Diane P. Hickey & Dr. John Carlisle of ADT discuss diamond advances for micro manufacturing in EuroAsia Semiconductor magazine.

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Products < Mems

Diamond is the ultimate MEMS substrate material. In the weeks and months ahead you will hear a lot more about ADT's development of diamond MEMS devices. Note that we are NOT coating silicon MEMS devices (although we could), but rather UNCD® is being used as a structural material and entire electromechanical devices are being made out of diamond. Our NaDiaProbes™ will give you a peek at what's possible.

If you want to get started making diamond MEMS devices, our UNCD wafers will get you there. RIE is used to etch the diamond, and traditional microfabrication techniques can be used for the photolithography and other microfabrication steps.

Questions: Please contact ADT.

 

Advanced Diamond Technologies, Inc.
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Advanced Diamond Technologies, Inc.